wanispissd wrote:Your PCB program should export a drill file (in addition to the Gerber artwork), which will contain the XY coordinates of each VIA hole. Typically it is sorted by drill size, so it should be easy to find the section that correlates with the plated thru-holes for leads.
You may find that you will have better luck duplicating a selective solder type machine that pumps molten solder up a tube from the bottom to form a 'point' solder wave (think like holding a garden hose vertically). The trick for materials selection is to use titanium for the tube and the solder pot and pump components (the solder will not stick to it, and it will not diffuse into the metal). Ive been considering building a type of 'pulse' pump that may be realistic for a hobbiest, that would function similar to one of those Nalgene squeeze bottle (often used in labs). The commercial ones are a continuous solder flow, but that is probably too much $$$ for the pump.
Anyway, I am looking forward to seeing this !
Soldering robots (ie a soldering iron and solder wire feeder with an XY platform) are
standard gear, sold by a wide range of manufacturers. I am sure a selective solder
machine with a solder fountain may be faster, but it seems a lot of commercial work
is done with the robot-style machine. Since I do VERY small batches, like often
a dozen boards, the heat-up time, dross and clean-up with a fountain machine
sounds like a big hassle. Also, my scheme should be able to be changed over from
tin-lead to lead-free in a few minutes, the fountain machine probably could not be
changed over, you'd have to have two complete pot/pump/fountain systems.
Nicholas Benezan built a fountain machine from scratch, but it looks quite complicated.
So, I have reasons to prefer the robot soldering iron scheme.
Jon